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MX29F016
16M-BIT [2M X 8] CMOS EQUAL SECTOR FLASH MEMORY
FEATURES
* Single power supply 5V operation for read, erase and program * Fast access time: 90/120ns * Low power consumption - 30mA maximum active current - 0.2uA typical standby current * Command register architecture - Byte Programming (7us typical) - Sector Erase:32 equal sector with of 64KByte each * Auto Erase (chip & sector) and Auto Program - Automatically erase any combination of sectors with Erase Suspend capability. - Automatically program and verify data at specified address * Erase suspend/Erase Resume - Suspends an erase operation to read data from, or program data to, another sector that is not being erased, then resumes the erase. * Status Reply - Data polling & Toggle bit for detection of program and erase cycle completion. * Group Sector protect/unprotect for 5V/12V system. * Group Sector protection - Hardware sector protect/unprotect method for each group which consists of two adjacent sectors - Temporary group sector unprotect allows code changes in previously locked sectors * 100,000 minimum erase/program cycles * Latch-up protected to 100mA from -1V to VCC+1V * Low VCC write inhibit is equal to or less than 3.2V * Package type: - 40-pin TSOP, 44-pin SOP, 48-pin TSOP * Compatibility with JEDEC standard - Pinout and software compatible with single-power supply Flash
GENERAL DESCRIPTION
The MX29F016 is a 16-mega bit Flash memory organized as 2M bytes of 8 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29F016 is packaged in 40-pin TSOP or 44-pin SOP, 48-pin TSOP. It is designed to be reprogrammed and erased in system or in standard EPROM programmers. The standard MX29F016 offers access time as fast as 90ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29F016 has separate chip enable (CE) and output enable (OE ) controls. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29F016 uses a command register to manage this functionality. The command register allows for 100% TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maximum EPROM compatibility. MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and program mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and programming operations produces reliable cycling. The MX29F016 uses a 5.0V10% VCC supply to perform the High Reliability Erase and auto Program/Erase algorithms. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamps on address and data pin from -1V to VCC + 1V.
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PIN CONFIGURATIONS
40 TSOP (Standard Type) (10mm x 20mm)
A19 A18 A17 A16 A15 A14 A13 A12 CE VCC NC RESET A11 A10 A9 A8 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A20 NC WE OE RY/BY Q7 Q6 Q5 Q4 VCC VSS VSS Q3 Q2 Q1 Q0 A0 A1 A2 A3
48 TSOP (Standard Type) (12mm x 20mm)
NC NC A19 A18 A17 A16 A15 A14 A13 A12 CE VCC NC RESET A11 A10 A9 A8 A7 A6 A5 A4 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 NC NC A20 NC WE OE RY/BY Q7 Q6 Q5 Q4 VCC VSS VSS Q3 Q2 Q1 Q0 A0 A1 A2 A3 NC NC
MX29F016
MX29F016
44 SOP
NC RESET A11 A10 A9 A8 A7 A6 A5 A4 NC NC A3 A2 A1 A0 Q0 Q1 Q2 Q3 VSS VSS 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 VCC CE A12 A13 A14 A15 A16 A17 A18 A19 NC NC A20 NC WE OE RY/BY Q7 Q6 Q5 Q4 VCC
PIN DESCRIPTION
SYMBOL A0~A20 Q0~Q7 CE WE OE RESET RY/BY VCC VSS NC PIN NAME Address Input 8 Data Inputs/Outputs Chip Enable Input Write Enable Input Output Enable Input Hardware Reset Pin, Active Low Read/Busy Output +5.0V single power supply Device Ground Pin Not Connected Internally
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MX29F016 SECTOR ADDRESS TABLE
Group Sector A20 A19 A18 A17 A16 Address Range Sector SGA0 SA0 SGA0 SA1 SGA0 SA2 SGA0 SA3 SGA1 SA4 SGA1 SA5 SGA1 SA6 SGA1 SA7 SGA2 SA8 SGA2 SA9 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 000000h-00FFFFh 010000h-01FFFFh 020000h-02FFFFh 030000h-03FFFFh 040000h-04FFFFh 050000h-05FFFFh 060000h-06FFFFh 070000h-07FFFFh 080000h-08FFFFh 090000h-09FFFFh 0A0000h-0AFFFFh 0B0000h-0BFFFFh 0C0000h-0CFFFFh 0D0000h-0DFFFFh 0E0000h-0EFFFFh 0F0000h-0FFFFFh 100000h-10FFFFh 110000h-11FFFFh 120000h-12FFFFh 130000h-13FFFFh 140000h-14FFFFh 150000h-15FFFFh 160000h-16FFFFh 170000h-17FFFFh 180000h-18FFFFh 190000h-19FFFFh 1A0000h-1AFFFFh 1B0000h-1BFFFFh 1C0000h-1CFFFFh 1D0000h-1DFFFFh 1E0000h-1EFFFFh 1F0000h-1FFFFFh
LOGIC SYMBOL
21 A0-A20 Q0-Q7 8
CE OE WE RESET RY/BY
SGA2 SA10 0 SGA2 SA11 0 SGA3 SA12 0 SGA3 SA13 0 SGA3 SA14 0 SGA3 SA15 0 SGA4 SA16 1 SGA4 SA17 1 SGA4 SA18 1 SGA4 SA19 1 SGA5 SA20 1 SGA5 SA21 1 SGA5 SA22 1 SGA5 SA23 1 SGA6 SA24 1 SGA6 SA25 1 SGA6 SA26 1 SGA6 SA27 1 SGA7 SA28 1 SGA7 SA29 1 SGA7 SA30 1 SGA7 SA31 1
Legend:SA=Sector Address ; SGA=Sector Group Address Note:All sectors are 64 Kbytes in size.
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BLOCK DIAGRAM
WRITE CE OE WE CONTROL INPUT LOGIC HIGH VOLTAGE MACHINE (WSM) PROGRAM/ERASE STATE
X-DECODER
MX29F016 FLASH ARRAY ARRAY
STATE REGISTER
ADDRESS LATCH A0-A20 AND BUFFER
SENSE AMPLIFIER
Y-DECODER
Y-PASS GATE
SOURCE HV COMMAND DATA DECODER
PGM DATA HV COMMAND DATA LATCH
PROGRAM DATA LATCH
Q0-Q7
I/O BUFFER
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AUTOMATIC PROGRAMMING
The MX29F016 is byte programmable using the Automatic Programming algorithm. The Automatic Programming algorithm makes the external system do not need to have time out sequence nor to verify the data programmed. The typical chip programming time at room temperature of the MX29F016 is less than 15 seconds. automatically pre-program and verify the entire array. Then the device automatically times the erase pulse width, provides the erase verification, and counts the number of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the status of the programming operation. Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. During a system write cycle, addresses are latched on the falling edge, and data are latched on the rising edge of WE . MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29F016 electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by using the EPROM programming mechanism of hot electron injection. During a program cycle, the state-machine will control the program sequences and command register will not respond to any command set. During a Sector Erase cycle, the command register will only respond to Erase Suspend command. After Erase Suspend is completed, the device stays in read mode. After the state machine has completed its task, it will allow the command register to respond to its full command set.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses according to MXIC's Automatic Chip Erase algorithm. Typical erasure at room temperature is accomplished in less than 19 seconds. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device.
AUTOMATIC SECTOR ERASE
The MX29F016 is sector(s) erasable using MXIC's Auto Sector Erase algorithm. Sector erase modes allow sectors of the array to be erased in one erase cycle. The Automatic Sector Erase algorithm automatically programs the specified sector(s) prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm require the user to only write program set-up commands (including 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times the programming pulse width, provides the program verification, and counts the number of sequences. A status bit similar to DATA polling and a status bit toggling between consecutive read cycles, provide feedback to the user as to the status of the programming operation.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to write commands to the command register using standard microprocessor write timings. The device will
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TABLE1. SOFTWARE COMMAND DEFINITIONS
First Bus Command Reset Read Read Silicon ID Sector Group Protect Verify Program Chip Erase Sector Erase Sector Erase Suspend Sector Erase Resume 4 6 6 1 1 555H 555H 555H XXXH XXXH AAH AAH AAH B0H 30H 2AAH 55H 2AAH 55H 2AAH 55H 555H A0H 555H 80H 555H 80H Bus Cycle 1 1 4 4 Cycle Addr XXXH RA 555H 555H F0H RD AAH AAH 2AAH 55H 2AAH 55H 555H 90H 555H 90H ADI SGA PA DDI 00H PD 2AAH 55H 2AAH 55H 555H 10H SA 30H Second Bus Cycle Data Addr Third Bus Cycle Data Addr Fourth Bus Cycle Data Addr Fifth Bus Cycle Data Addr Data Sixth Bus Cycle Addr Data
X02H 01H 555H AAH 555H AAH
Note: 1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacture code,A1=0, A0 = 1 for device code. (Refer to Table 3) DDI = Data of Device identifier : C2H for manufacture code, ADH for device code. X = X can be VIL or VIH RA=Address of memory location to be read. RD=Data to be read at location RA. 2.PA = Address of memory location to be programmed. PD = Data to be programmed at location PA. SA = Address of the sector to be erased. SGA = Address of the Sector Group Address bits A18-A20 select a uniqul sector group. 3.The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 . Address bit A11~A20=X=Don't care for all address commands except for Program Address (PA) and Sector Address (SA). Write Sequence may be initiated with A11~A20 in either state. 4.For Sector Group Protect Verify Operation : If read out data is 01H, it means the sector has been protected.If read out data is 00H,it means the sector is still not being protected.
COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 1 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress.
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TABLE 2. MX29F016 BUS OPERATION
Mode Read Silicon ID Manufacturer Code(1) Read Silicon ID Device Code(1) Read Standby Output Disable Write Sector Protect with 12V system(6) Chip Unprotect with 12V system(6) Verify Sector Group Protect with 12V system Reset X X X X X X X HIGH Z L L H X H X VID(2) Code(5) L VID(2) L X X H VID(2) X L H L L L L X H H VID(2) H X H L L A0 X X A0 X A1 X X A1 X A6 X X A6 L A9 X X A9 VID(2) DOUT HIGH Z HIGH Z DIN(3) X L L H H L X VID(2) ADH Pins CE L OE L WE H A0 L A1 L A6 X A9 VID(2) Q0 ~ Q7 C2H
NOTES: 1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1. 2. VID is the Silicon-ID-Read high voltage, 11.5V to 13V. 3. Refer to Table 1 for valid Data-In during a write operation. 4. X can be VIL or VIH. 5. Code=00H means unprotected. Code=01H means protected. A20~A18=Sector Group address for protect. 6. Refer to sector protect/unprotect algorithm and waveform.
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READ/RESET COMMAND
The read or reset operation is initiated by writing the read/reset command sequence into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid command must then be written to place the device in the desired state.
SET-UP AUTOMATIC CHIP/SECTOR ERASE
Chip erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the "set-up" command 80H. Two more "unlock" write cycles are then followed by the chip erase command 10H. The Automatic Chip Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Chip Erase. Upon executing the Automatic Chip Erase, the device will automatically program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are completed when the data on Q7 is "1" at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array(no erase verification command is required). If the Erase operation was unsuccessful, the data on Q5 is "1"(see Table 4), indicating the erase operation exceed internal timing limit. The automatic erase begins on the rising edge of the last WE pulse in the command sequence and terminates when the data on Q7 is "1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode.
SILICON-ID-READ COMMAND
Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacturer and device codes must be accessible while the device resides in the target system. PROM programmers typically access signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto address lines is not generally desired system design practice. The MX29F016 contains a Silicon-ID-Read operation to supplement traditional PROM programming methodology. The operation is initiated by writing the read silicon ID command sequence into the command register. Following the command write, a read cycle with A1=VIL,A0=VIL retrieves the manufacturer code of C2H. A read cycle with A1=VIL, A0=VIH returns the device code of ADH for MX29F016.
TABLE 3. SILICON ID CODE
Pins Manufacture code Device code for MX29F016 A0 VIL VIH A1 VIL VIL Q7 1 1 Q6 1 0 Q5 0 1 Q4 0 0 Q3 0 1 Q2 0 1 Q1 1 0 Q0 0 1 Code(Hex) C2H ADH
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SECTOR ERASE COMMANDS
The Automatic Sector Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Set-up Sector Erase command and Automatic Sector Erase command. Upon executing the Automatic Sector Erase command, the device will automatically program and verify the sector(s) memory for an all-zero data pattern. The system is not required to provide any control or timing during these operations. When the sector(s) is automatically verified to contain an all-zero pattern, a self-timed sector erase and verify begin. The erase and verify operations are complete when the data on Q7 is "1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic Sector Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verification command is required). Sector erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the set-up command 80H. Two more "unlock" write cycles are then followed by the sector erase command 30H. The sector address is latched on the falling edge of WE, while the command(data) is latched on the rising edge of WE. Sector addresses selected are loaded into internal register on the sixth falling edge of WE. Each successive sector load cycle started by the falling edge of WE must begin within 80ms from the rising edge of the preceding WE. Otherwise, the loading period ends and internal auto sector erase cycle starts. (Monitor Q3 to determine if the sector erase timer window is still open, see section Q3, Sector Erase Timer.) Any command other than Sector Erase(30H) or Erase Suspend(B0H) during the timeout period resets the device to read mode.
Table 4. Write Operation Status
Status Byte Program in Auto Program Algorithm Auto Erase Algorithm Erase Suspend Read In Progress Erase Suspended Mode (Erase Suspended Sector) Erase Suspend Read (Non-Erase Suspended Sector) Erase Suspend Program (Non-Erase Suspended Sector) Byte Program in Auto Program Algorithm Exceeded Program/Erase in Auto Erase Algorithm Erase Suspend Program (Non-Erase Suspended Sector) Time Limits Erase Suspended Mode Q7 0 Q7 Q7 Toggle (Note2) Toggle Toggle Toggle 1 1 1 0 1 0 0 0 1 (Note3) 1 N/A N/A Data Data Data Data Q7 Q7 0 1 Q6 Toggle Toggle 1 Q5 0 0 0 Q3 0 1 0 Q2 1 Toggle Toggle (Note1) Data
Notes: 1.Performing successive read operations from the erase-suspended sector will cause Q2 to toggle. 2.Performing successive read operations from any address will cause Q6 to toggle. 3.Reading the byte address being programmed while in the erase-suspend program mode will indicate logic "1" at the Q2 bit. However, successive reads from the erase-suspended sector will cause Q2 to toggle.
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ERASE SUSPEND
This command only has meaning while the state machine is executing Automatic Sector Erase operation, and therefore will only be responded during Automatic Sector Erase operation. However, When the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After this command has been executed, the command register will initiate erase suspend mode. The state machine will return to read mode automatically after suspend is ready. At this time, state machine only allows the command register to respond to the Read Memory Array, Erase Resume and program commands. The system can determine the status of the program operation using the Q7 or Q6 status bits, just as in the standard program operation. After an erase-suspend program operation is complete, the system can once again read array data within non-suspended blocks. If the program opetation was unsuccessful, the data on Q5 is "1"(see Table 4), indicating the program operation exceed internal timing limit. The automatic programming operation is completed when the data read on Q6 stops toggling for two consecutive read cycles and the data on Q7 and Q6 are equivalent to data written to these two bits, at which time the device returns to the Read mode(no program verify command is required).
DATA POLLING-Q7
The MX29F016 also features Data Polling as a method to indicate to the host system that the Automatic Program or Erase algorithms are either in progress or completed. While the Automatic Programming algorithm is in operation, an attempt to read the device will produce the complement data of the data last written to Q7. Upon completion of the Automatic Program Algorithm an attempt to read the device will produce the true data last written to Q7. The Data Polling feature is valid after the rising edge of the fourth WE pulse of the four write pulse sequences for automatic program. While the Automatic Erase algorithm is in operation, Q7 will read "0" until the erase operation is competed. Upon completion of the erase operation, the data on Q7 will read "1". The Data Polling feature is valid after the rising edge of the sixth WE pulse of six write pulse sequences for automatic chip/sector erase. The Data Polling feature is active during Automatic Program/Erase algorithm or sector erase time-out.(see section Q3 Sector Erase Timer)
ERASE RESUME
This command will cause the command register to clear the suspend state and return back to Sector Erase mode but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect in all other conditions.Another Erase Suspend command can be written after the chip has resumed erasing.
SET-UP AUTOMATIC PROGRAM COMMANDS
To initiate Automatic Program mode, A three-cycle command sequence is required. There are two "unlock" write cycles. These are followed by writing the Automatic Program command A0H. Once the Automatic Program command is initiated, the next WE pulse causes a transition to an active programming operation. Addresses are latched on the falling edge, and data are internally latched on therising edge of the WE pulse. The rising edge of WE also begins the programming operation. The system is not required to provide further controls or timings. The device will automatically provide an adequate internally generated program pulse and verify margin.
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Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE pulse in the command sequence(prior to the program or erase operation), and during the sector time-out. During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6 to toggle. The system may use either OE or CE to control the read cycles. When the operation is complete, Q6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use Q6 and Q2 together to determine whether a sector is actively erasing or is erase suspended. When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling. When the device enters the Erase Suspend mode, Q6 stops toggling. However, the system must also use Q2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use Q7. If a program address falls within a protected sector, Q6 toggles for approximately 2us after the program command sequence is written, then returns to reading array data. Q6 also toggles during the erase-suspend-program mode, and stops toggling once the Automatic Program algorithm is complete. Table 4 shows the outputs for Toggle Bit I on Q6. Q2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE or CE to control the read cycles.) But Q2 cannot distinguish whether the sector is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sectors and mode information. Refer to Table 4 to compare outputs for Q2 and Q6.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit status, it must read Q7-Q0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on Q7-Q0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high (see the section on Q5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as Q5 went high. If the toggle bit is no longer toggling, the device has successfuly completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that system initially determines that the toggle bit is toggling and Q5 has not gone high. The system may continue to monitor the toggle bit and Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates whether a particular sector is actively eraseing (that is, the Automatic Erase alorithm is in process), or whether that sector is erase-suspended. Toggle Bit I is valid after the rising edge of the final WE pulse in the command sequence.
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Q5 Exceeded Timing Limits
Q5 will indicate if the program or erase time has exceeded the specified limits(internal pulse count). Under these conditions Q5 will produce a "1". This time-out condition indicates that the program or erase cycle was not successfully completed. Data Polling and Toggle Bit are the only operating functions of the device under this condition. If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it may not be reused. However, other sectors are still functional and may be used for the program or erase operation. The device must be reset to use other sectors. Write the Reset command sequence to the device, and then execute program or erase command sequence. This allows the system to continue to use the other active sectors in the device. If this time-out condition occurs during the chip erase operation, it specifies that the entire chip is bad or combination of sectors are bad. If this time-out condition occurs during the byte programming operation, it specifies that the entire sector containing that byte is bad and this sector maynot be reused, (other sectors are still functional and can be reused). The time-out condition may also appear if a user tries to program a non blank location without erasing. In this case the device locks out and never completes the Automatic Algorithm operation. Hence, the system never reads a valid data on Q7 bit and Q6 never stops toggling. Once the Device has exceeded timing limits, the Q5 bit will indicate a "1". Please note that this is not a device failure condition since the device was incorrectly used. cycles resulting from VCC power-up and power-down transition or system noise.
TEMPORARY SECTOR UNPROTECT This feature allows temporary unprotection of previously protected sector to change data in-system. The Temporary Sector Unprotect mode is activated by setting the RESET pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased as unprotected sector. Once VID is remove from the RESET pin,all the previously protected sectors are protected again.
Q3 Sector Erase Timer
After the completion of the initial sector erase command sequence, the sector erase time-out will begin. Q3 will remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase command sequence. If Data Polling or the Toggle Bit indicates the device has been written with a valid erase command, Q3 may be used to determine if the sector erase timer window is still open. If Q3 is high ("1") the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by Data Polling or Toggle Bit. If Q3 is low ("0"), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of Q3 prior to and following each subsequent sector erase command. If Q3 were high on the second status check, the command may not have been accepted.
DATA PROTECTION
The MX29F016 is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power up the device automatically resets the state machine in the Read mode. In addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific command sequences. The device also incorporates several features to prevent inadvertent write
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WRITE PULSE "GLITCH" PROTECTION
Noise pulses of less than 5ns(typical) on CE or WE will not initiate a write cycle.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE = VIL, CE = VIH or WE = VIH. To initiate a write cycle CE and WE must be a logical zero while OE is a logical one.
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POWER SUPPLY DECOUPLING
In order to reduce power switching effect, each device should have a 0.1uF ceramic capacitor connected between its VCC and GND. in the system by writing the Read Silicon ID command. Performing a read operation with A1=VIH, it will produce 00H at data outputs(Q0-Q7) for an unprotected sector. It is noted that all sectors are unprotected after the chip unprotect algorithm is completed.
SECTOR PROTECTION WITH 12V SYSTEM
The MX29F016 features hardware group sector protection. This feature will disable both program and erase operations for these group sector protected. To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE, (suggest VID = 12V) A6 = VIL and CE = VIL.(see Table 2) Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated on the rising edge. Please refer to group sector protect algorithm and waveform. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 ( with CE and OE at VIL and WE at VIH). When A1=1, it will produce a logical "1" code at device output Q0 for a protected sector. Otherwise the device will produce 00H for the unprotected sector. In this mode, the addresses, except for A1, are don't care. Address locations with A1 = VIL are reserved to read manufacturer and device codes.(Read Silicon ID) It is also possible to determine if the group is protected in the system by writing a Read Silicon ID command. Performing a read operation with A1=VIH, it will produce a logical "1" at Q0 for the protected sector.
POWER-UP SEQUENCE
The MX29F016 powers up in the Read only mode. In addition, the memory contents may only be altered after successful completion of the predefined command sequences.
CHIP UNPROTECT WITH 12V SYSTEM
The MX29F016 also features the chip unprotect mode, so that all sectors are unprotected after chip unprotect is completed to incorporate any changes in the code. It is recommended to protect all sectors before activating chip unprotect mode. To activate this mode, the programming equipment must force VID on control pin OE and address pin A9. The CE pins must be set at VIL. Pins A6 must be set to VIH.(see Table 2) Refer to chip unprotect algorithm and waveform for the chip unprotect algorithm. The unprotection mechanism begins on the falling edge of the WE pulse and is terminated on the rising edge. It is also possible to determine if the chip is unprotected
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MX29F016
CAPACITANCE (TA = 25oC, f = 1.0 MHz)
SYMBOL CIN COUT PARAMETER Input Capacitance Output Capacitance MIN. TYP MAX. 8 12 UNIT pF pF CONDITIONS VIN = 0V VOUT = 0V
READ OPERATION
DC CHARACTERISTICS (TA = -40 C TO 85 C, VCC = 5V10%)
SYMBOL ILI ILO ISB1 ISB2 ICC1 ICC2 VIL VIH VOL VOH Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage 2.4 -0.3(NOTE 1) 2.0 Operating VCC current PARAMETER Input Leakage Current Output Leakage Current Standby VCC current 0.2 MIN. TYP MAX. 1 1 1 5 30 50 0.8 VCC + 0.3 0.45 UNIT uA uA mA uA mA mA V V V V IOL = 2.1mA IOH = -2mA CONDITIONS VIN = GND to VCC VOUT = GND to VCC CE = VIH CE = VCC + 0.3V IOUT = 0mA, f=1MHz IOUT = 0mA, f=10MHz
NOTES: 1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns. VIL min. = -2.0V for pulse width is equal to or less than 20 ns.
2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns If VIH is over the specified maximum value, read operation cannot be guaranteed.
AC CHARACTERISTICS (TA = -40oC to 85oC, VCC = 5V10%) Read Operations
29F016-90 SYMBOL tACC tCE tOE tDF tOH PARAMETER Address to Output Delay CE to Output Delay OE to Output Delay OE High to Output Float (Note1) Address to Output hold 0 0 NOTE: 1. tDF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. MIN. 29F016-12 UNIT ns ns ns ns ns CONDITIONS CE=OE=VIL OE=VIL CE=VIL CE=VIL CE=OE=VIL MAX. MIN. MAX. 90 90 40 30 0 0 120 120 50 30
TEST CONDITIONS: * Input pulse levels: 0.45V/2.4V* * Input rise and fall times is equal to or less than 20ns * Output load: 1 TTL gate + 100pF *(Including scope and jig) * Reference levels for measuring timing*: 0.8V, 2.0V
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MX29F016
ABSOLUTE MAXIMUM RATINGS
RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential A9 & OE VALUE -40oC to 85oC -65oC to 125oC -0.5V to 7.0V -0.5V to 7.0V -0.5V to 7.0V -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change.
READ TIMING WAVEFORMS
VIH
Addresses
VIL
ADD Valid
tCE VIH
CE
VIL
WE
VIH VIL VIH VIL tACC tOH tOE tDF
OE
Outputs
VOH VOL
HIGH Z
DATA Valid
HIGH Z
COMMAND PROGRAMMING/DATA PROGRAMMING/ERASE OPERATION
DC CHARACTERISTICS (TA = -40oC to 85oC, VCC = 5V10%)
SYMBOL ICC1 (Read) ICC2 ICC3 (Program) ICC4 (Erase) ICCES NOTES: 1. VIL min. = -0.6V for pulse width is equal to or less than 20ns. 2. If VIH is over the specified maximum value, programming operation cannot be guranteed.
P/N:PM0590
PARAMETER Operating VCC Current
MIN.
TYP
MAX. 30 50 50 50
UNIT mA mA mA mA mA
CONDITIONS IOUT=0mA, f=1MHz IOUT=0mA, F=10MHz In Programming In Erase CE=VIH, Erase Suspended
VCC Erase Suspend Current
2
3. ICCES is specified with the device de-selected. If the device is read during erase suspend mode, current draw is the sum of ICCES and ICC1 or ICC2. 4. All current are in RMS unless otherwise noted.
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MX29F016
AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 5V 10% Erase/Program Operations
29F016-90 SYMBOL
tOES tCWC tCEP tCEPH1 tCEPH2 tAS tAH tDS tDH tCESC tDF tAETC tAETB tAVT tBAL tCH tCS tVLHT tOESP tWPP1 tWPP2
29F016-12 MAX. UNIT
ns ns ns ns ns ns ns ns ns ns 30 32(TYP.) 256 4(TYP.) 30 7(TYP.) 300 80 0 0 4 4 10 12 ns s s us us ns ns us us us ms
PARAMETER
OE setup time Command programming cycle WE programming pulse width WE programming pulse width High WE programming pulse width High Address setup time Address hold time Data setup time Data hold time CE setup time before command write Output disable time (Note 1) Total erase time in auto chip erase(Note2,3)
MIN.
50 90 45 20 20 0 45 45 0 0
MAX. MIN.
50 120 50 20 20 0 50 50 0 0 30
CONDITIONS
32(TYP.) 256 30 300
Total erase time in auto sector erase(Note2,3) 4(TYP.) Byte programming time in auto verify(Note2,3) Block address load time CE Hold Time CE setup to WE going low Voltge Transition Time OE Setup Time to WE Active Write pulse width for sector protect Write pulse width for sector unprotect 7(TYP.) 80 0 0 4 4 10 12
NOTES: 1. tDF defined as the time at which the output achieves the open circuit condition and data is no longer driven. 2. Numbers are sampled, not 100% tested. 3. Typical values are measured at 25oC,VCC=5.0V.
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MX29F016
SWITCHING TEST CIRCUITS
DEVICE UNDER TEST 1.6K ohm +5V
CL
1.2K ohm
DIODES=IN3064 OR EQUIVALENT
CL=100pF Including jig capacitance
SWITCHING TEST WAVEFORMS
2.4V
2.0V 2.0V
TEST POINTS
0.8V
0.45V INPUT
0.8V OUTPUT
AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0". Input pulse rise and fall times are <20ns.
COMMAND WRITE TIMING WAVEFORM
VCC
5V
Addresses
VIH
ADD Valid
VIL tAS tAH
WE
VIH VIL tOES tCEPH1 tCWC
tCEP
CE
VIH VIL tCS tCH
OE
VIH VIL VIH tDS tDH
Data
VIL
DIN
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MX29F016
AUTOMATIC PROGRAMMING TIMING WAVEFORM
One byte data is programmed. Verify in fast algorithm and additional programming by external control are not required because these operations are executed automatically by internal control circuit. Programming completion can be verified by DATA polling and toggle bit checking after automatic verification starts. Device outputs DATA during programming and DATA after programming on Q7.(Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform)
AUTOMATIC PROGRAMMING TIMING WAVEFORM
Vcc 5V
A11~A20
ADD Valid
A0~A10 WE
555H
2AAH
555H
ADD Valid
tAS tAH
tCWC tCEPH1 tAVT tCESC
CE tCEP OE tDS tDH Q0,Q1, Q4(Note 1) Q7
Command In Command #AAH (Q0~Q7) Command In Command #55H Command In Command #A0H Data In Command In Command In Command In Data In DATA
tDF
DATA polling
DATA DATA
tOE
Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit
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MX29F016
AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
Toggle Bit Checking Q6 not Toggled YES
NO .
Invalid Command
NO Verify Byte Ok YES NO Auto Program Completed Q5 = 1 YES
Reset
Auto Program Exceed Timing Limit
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MX29F016
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verification is not required because data is erased automatically by internal control circuit. Erasure completion can be verified by DATA polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform)
AUTOMATIC CHIP ERASE TIMING WAVEFORM
Vcc 5V
A11~A20
A0~A10 WE
555H
2AAH
555H
555H
2AAH
555H
tAS tAH
tCWC tCEPH1 tAETC tCESC
CE tCEP OE tDS tDH Q0,Q1, Q4(Note 1) Q7
Command In Command #AAH Command In Command #55H Command In Command #80H Command In Command #AAH Command In Command #55H Command In Command #10H Command In Command In Command In Command In Command In Command In
tDF
DATA polling
(Q0~Q7) Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit
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MX29F016
AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Toggle Bit Checking Q6 not Toggled YES
NO
.
Invalid Command
NO
DATA Polling Q7 = 1 YES NO Q5 = 1
Auto Chip Erase Completed
YES Reset
Auto Chip Erase Exceed Timing Limit
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MX29F016
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Block data indicated by A16 to A20 are erased. External erase verify is not required because data are erased automatically by internal control circuit. Erasure completion can be verified by DATA polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform)
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Vcc 5V
A16~A20
Sector Address 0
Sector Address 1
Sector Address N
A0~A10 WE
555H
2AAH
555H
555H
2AAH
tAS tAH
tCWC tCEPH1 tCEPH2 tBAL tAETB tCESC
CE tCEP OE tDS tDH Q0,Q1,
Command In Command In Command In Command In Command In Command In Command In Command In
tDF
Q4(Note 1) Q7
Command In Command #30H
DATA polling
Command In Command #AAH Command In Command #55H Command In Command #80H Command In Command #AAH Command In Command #55H Command In Command #30H Command In Command #30H
(Q0~Q7) Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit
tDPA
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MX29F016
AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
Toggle Bit Checking Q6 Toggled ?
NO Invalid Command
YES Load Other Sector Addrss If Necessary (Load Other Sector Address)
Last Sector to Erase YES
NO
Time-out Bit Checking Q3=1 ?
NO
YES NO
Toggle Bit Checking Q6 not Toggled YES
. DATA Polling Q7 = 1 Q5 = 1
Reset Auto Sector Erase Completed
Auto Sector Erase Exceed Timing Limit
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MX29F016
ERASE SUSPEND/ERASE RESUME FLOWCHART
START
Write Data B0H
NO Toggle Bit checking Q6 not toggled YES Read Array or Program
Reading or Programming End YES Write Data 30H
NO
.
Continue Erase
Another Erase Suspend ? YES
NO
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MX29F016
TIMING WAVEFORM FOR GROUP SECTOR PROTECTION FOR SYSTEM WITH 12V
A1
A6
12V 5V A9
tVLHT Verify
12V 5V OE
tVLHT tWPP 1 tVLHT
WE
tOESP
CE
Data
tOE
01H
A20-A16
Group Sector Address
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MX29F016
TIMING WAVEFORM FOR CHIP UNPROTECTION FOR SYSTEM WITH 12V
A1
12V 5V A9
tVLHT
A6
Verify
12V 5V OE
tVLHT tWPP 2 tVLHT
WE
tOESP
CE
Data
tOE
00H
A20-A16
Sector Address
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MX29F016
SECTOR GROUP PROTECTION ALGORITHM FOR SYSTEM WITH 12V
START
Set Up Sector Group Addr (A20, A19, A18)
PLSCNT=1
OE=VID,A9=VID,CE=VIL A6=VIL
Activate WE Pulse
Time Out 10us
Set WE=VIH, CE=OE=VIL A9 should remain VID . No Read from Sector Group Addr=SGA, A1=1
PLSCNT=32?
No
Data=01H?
Yes Device Failed
Protect Another Group Sector?
Yes
Remove VID from A9 Write Reset Command
Sector Group Protection Complete
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MX29F016
CHIP UNPROTECTION ALGORITHM FOR SYSTEM WITH 12V
START
Protect All Sectors
PLSCNT=1
Set OE=A9=VID CE=VIL,A6=1
Activate WE Pulse
Time Out 12ms
Increment PLSCNT
Set OE=CE=VIL A9=VID,A1=1
Set Up First Sector Addr
Read Data from Device No
Increment Sector Addr
Data=00H?
No PLSCNT=1000?
Yes No
Yes Device Failed
All sectors have been verified? Yes Remove VID from A9 Write Reset Command
Chip Unprotect Complete
* It is recommended before unprotect the whole chip, all sectors should be protected in advance.
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MX29F016
TEMPORARY SECTOR UNPROTECT ALGORITHM
Start
RESET = VID (Note 1) Perform Erase or Program Operation Operation Completed RESET = VIH Temporary Sector Unprotect Completed(Note 2)
Note : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V 2. All previously protected sectors are protected again.
P/N:PM0590
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MX29F016
ID CODE READ TIMING WAVEFORM
VCC 5V
ADD A9
VIH VIL
VID VIH VIL
ADD A0 A1
tACC VIH VIL
tACC
ADD A2-A8 A10-A20 CE
VIH VIL
VIH VIL
WE
VIH VIL
tCE
OE
VIH VIL
tOE tDF tOH tOH
VIH
DATA Q0-Q7
DATA OUT
VIL
DATA OUT ADH
C2H
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MX29F016
ERASE AND PROGRAMMING PERFORMANCE(1)
PARAMETER
Sector Erase Time Chip Erase Time Byte Programming Time Chip Programming Time Erase/Program Cycles 100,000
MIN.
LIMITS TYP.(2)
4 32 7 15
MAX.(3)
30 256 300 45
UNITS
sec sec us sec Cycles
Note:
1.Not 100% Tested, Excludes external system level over head. 2.Typical values measured at 25 C,5V. 3.Maximum values measured at 25 C,4.5V.
LATCH-UP CHARACTERISTICS
MIN. Input Voltage with respect to GND on all pins except I/O pins Input Voltage with respect to GND on all I/O pins Current Includes all pins except Vcc. Test conditions: Vcc = 5.0V, one pin at a time. -1.0V -1.0V -100mA MAX. 13.5V Vcc + 1.0V +100mA
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MX29F016
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) STANDBY CURRENT MAX.(uA) OPERATING TEMPERATURE PACKAGE
MX29F016T4C-90 90 MX29F016T4C-12 120 MX29F016MC-90 MX29F016MC-12 MX29F016TC-90 MX29F016TC-12 MX29F016T4I-90 MX29F016T4I-12 MX29F016MI-90 MX29F016MI-12 MX29F016TI-90 MX29F016TI-12 90 120 90 120 90 120 90 120 90 120
50 50 50 50 50 50 50 50 50 50 50 50
100 100 100 100 100 100 100 100 100 100 100 100
0C ~70C 0C ~70C 0C ~70C 0C ~70C 0C ~70C 0C ~70C -40C ~85C -40C ~85C -40C ~85C -40C ~85C -40C ~85C -40C ~85C
40 Pin TSOP (Normal Type) 40 Pin TSOP (Normal Type) 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 40 Pin TSOP (Normal Type) 40 Pin TSOP (Normal Type) 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type)
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MX29F016
PACKAGE INFORMATION
P/N:PM0590
REV. 1.4, NOV. 21, 2002
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MX29F016
P/N:PM0590
REV. 1.4, NOV. 21, 2002
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MX29F016
P/N:PM0590
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MX29F016
Revision History
Revision No. Description 1.1 Del Preliminary 1.2 Correct typing error Correct Erase/Program Operations tDF:40(MAX.)-->30(MAX.) 1.3 To modify the "chip unprotection algorithm for system with 12V" flowchart Add temporary sector unprotect algorithm To modify the "Package Information" 1.4 1. To modify the Package Information Page P1 P14 P16 P28 P29 P33~35 P33~35 Date OCT/23/2000 JAN/08/2001 JUN/13/2001
NOV/21/2002
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MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688 FAX:+886-3-563-2888
EUROPE OFFICE:
TEL:+32-2-456-8020 FAX:+32-2-456-8021
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TEL:+81-44-246-9100 FAX:+81-44-246-9105
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TEL:+65-348-8385 FAX:+65-348-8096
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MACRONIX AMERICA, INC.
TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.

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